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Suggestions for purchasing floor heating modules without backfill water

2026-03-06


Thermal conductivity: XPS extruded board modules with thermal conductivity ≤ 0.035W/(m · K) are preferred for faster heat dissipation.
Suggestions for purchasing floor heating modules without backfill water

Focus on core parameters
Thermal conductivity: XPS extruded board modules with thermal conductivity ≤ 0.035W/(m · K) are preferred for faster heat dissipation.
Flame retardant level: Engineering modules need to reach B2 level (extinguish immediately upon ignition), and household use can choose B1 level (flame retardant).
Compressive strength: Ensure that the compressive strength of the module is ≥ 500KPa to avoid deformation during long-term use.
Choose a reputable brand
Priority should be given to products certified according to the JGJ 142-2012 Technical Regulations for Radiant Heating and Cooling, such as Chongqing Yima and Qimu.
Avoid purchasing low-priced and inferior modules, as they may use recycled materials that result in poor thermal conductivity or easy aging.
Match types based on the scene
Floor type module: Choose a style with sound insulation layer to reduce thermal expansion and contraction noise.
Tile type module: Confirm whether the module supports tile laying (if cement filling and tiling are required).
Check the ground before installation
Use a 2-meter ruler to check the flatness of the ground. If the error exceeds the standard, self leveling treatment should be carried out in advance.
Ensure that all water and electricity pipelines are pre embedded to avoid module damage caused by later slotting.

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